SiCarrier’s Ambitious Roadmap: ASML-Compatible Tools Expected by 2026

SiCarrier plans to release ASML-compatible lithography machines by 2026, having developed 300-mm wafer tools for 28nm processes. Partnerships with major foundries and expansion plans are underway, underscored by its innovative technology and substantial client base, including SMIC and Hua Hong Group.

SiCarrier recently captured attention at SEMICON China by unveiling its ambitious product roadmap. The Chinese semiconductor equipment firm announced its development of lithography machines for 300-mm wafers utilizing 28nm processes, with plans to introduce upgraded versions compatible with ASML and Applied Materials by 2026, confirmed by Zhao Min, the Market Director at SiCarrier.

Moreover, SiCarrier’s Chief Technology Officer, Chen Dong, noted the establishment of partnerships with various fabs to create joint laboratories. The company anticipates announcing its initial set of commercial orders by the fourth quarter of 2025, marking a significant milestone in its development cycle. Noteworthy clients include prominent Chinese foundries such as SMIC and Hua Hong Group.

In the coming three years, SiCarrier intends to considerably expand its research and development centers to more than ten cities and establish service centres across Europe and Southeast Asia. Founded in 2022, SiCarrier boasts an impressive pedigree, with Dai Jun, the technology chief, involved with China’s Big Fund II and serving on the board of SMIC, according to the China Securities Times.

SiCarrier garnered significant media attention in 2023 for its patent related to creating 5nm chips employing DUV tools, closely associated with Huawei’s 7nm chip featured in the Mate 60 Pro. At SEMICON China, the firm showcased an extensive array of semiconductor manufacturing equipment, including metrology and inspection systems, although lithography tools were not publicly displayed. Despite this, reports indicate that SiCarrier possesses lithography machines capable of processing 300-mm wafers at both 28nm and earlier process nodes, further emphasizing its broad equipment portfolio in semiconductor production.

In summary, SiCarrier is positioning itself as a significant player in the semiconductor equipment industry with plans to develop ASML-compatible lithography tools by 2026. The company’s partnerships with leading domestic foundries and its ambitious expansion strategy in research and service capabilities highlight its growth potential. The innovative approach of SiCarrier, particularly its breakthrough technologies, underscores its commitment to advancing semiconductor manufacturing in China.

Original Source: www.trendforce.com